Hong Kong and Korean semiconductor leaders, anchored by Korea's two largest chipmakers.
Wonik IPS set its September 4, 2026 extraordinary shareholders’ meeting for 09:00, with agenda items to elect Choi Geun-min as an independent audit-committee director and approve a treasury-share holding and disposal plan.
Hanmi Semiconductor's KRW 44.2 billion HBM4 TC Bonder 4.5 Griffin supply contract with SK hynix remains scheduled to end on September 2, 2026.
NVIDIA is scheduled to report fiscal 2027 second-quarter results on August 26, providing a near-term read-through on AI infrastructure demand for SK hynix's next-generation memory partnership.
Isu Petasys formally announced an investor presentation for 18 August 2026, coinciding with the date third-party calendars list for its Q2 2026 earnings, although it did not formally designate that date as an earnings-release date.
Third-party earnings calendars now list Leeno Industrial’s Q2 2026 results for 18 August 2026, replacing the previously expected 13 August date, while a company release notice remains unverified.
Dongjin Semichem remains due to file its H1 2026 report by 14 August after releasing preliminary Q2 consolidated earnings on 6 August.
PSK HOLDINGS is scheduled to file its first-half 2026 report, including second-quarter financial results, by the August 14 statutory deadline.
Jusung Engineering’s 2026 first-half report remains due by August 14, 2026, following its July 29 preliminary consolidated second-quarter results release.
EO Technics is expected to file its H1 2026 report, covering the June quarter, by the standard 14 August DART deadline.
Tokai Carbon Korea's H1 2026 semiannual report is due by 14 August 2026, which should provide the reviewed detailed financial statements following the 7 August preliminary-results disclosure.
ISC's statutory 2026 semiannual report is due by August 14, 2026, covering the June 30 half year.
DOOSAN TESNA is expected to file its first-half 2026 report, containing second-quarter results, by the August 14, 2026 statutory deadline.
RFHIC is scheduled to file its H1 2026 semiannual report by the August 14 statutory deadline.
PSK is due to file its second-quarter 2026 quarterly report by 14 August 2026, providing the next formal update on semiconductor-equipment demand and profitability.
Daeduck Electronics is due to file its 2026 semiannual report by August 14 under the Financial Supervisory Service schedule for December year-end issuers.
HPSP is scheduled to reach the KRX deadline for filing its H1 2026 report on 14 August 2026.
RFHIC's July 27 meeting notice specified that the August 11 extraordinary general meeting will vote to authorize retention and disposal of all 245,063 treasury shares for employee compensation.
SK hynix said no decision has been made on a reported sale of an ownership stake in its Chongqing packaging plant, while confirming a review of options to strengthen packaging-business competitiveness.
Hanmi Semiconductor disclosed the establishment of its wholly owned U.S. subsidiary, HANMI USA, Inc., materially advancing its previously announced U.S. expansion plan.
SK hynix approved KRW 54.3 trillion of new construction investment for the Yongin Y2 DRAM/HBM fab and Cheongju M17 NAND fab.
Samsung began general availability of the Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8 on August 7, completing the retail launch following record South Korean preorders.
Tokai Carbon Korea disclosed preliminary standalone Q2 2026 revenue of KRW 94.873 billion and operating profit of KRW 26.850 billion on 7 August, superseding the market-data-provider date of 18 August.
Dongjin Semichem disclosed preliminary Q2 2026 consolidated revenue of KRW 346.9 billion and operating profit of KRW 59.3 billion, up 17.5% and 38.9% year over year, respectively.
Tokai Carbon's Q2 FY2026 analyst-meeting materials said Solid SiC focus-ring volumes rose significantly on strong memory-semiconductor demand and raised its FY2026 Fine Carbon forecast.
Wonik IPS released preliminary consolidated Q2 2026 revenue of KRW 216.5 billion and operating profit of KRW 18.4 billion.
SK hynix said it is reviewing measures to strengthen U.S. subsidiary Solidigm after a report of a KRW 5 trillion pre-IPO, with no decision made and a re-disclosure due September 4, 2026.
At FMS 2026, Samsung unveiled zHBM and zNAND-O concept models and its V10 BV-NAND architecture with more than 400 layers as part of its AI-memory roadmap.
Samsung entered five-year patent cross-license, settlement, memory-supply and ITC-cooperation agreements with Netlist, including a US$239 million upfront license payment and revenue-based quarterly payments.
SK hynix and Sandisk disclosed the first OCP HBF standard, specifying up to 512GB capacity and approximately 0.4TB/s to 3.0TB/s bandwidth.
Samsung announced Prime Video as the first streaming service to offer HDR10+ ADVANCED globally on supported titles for Samsung's 2026 TV lineup beginning in August 2026.