Akros SCHK HK-U.S. Semiconductor Index

Broadcom is estimated to release its fiscal third-quarter 2026 results on September 3, 2026.

NVIDIA is scheduled to report second-quarter fiscal 2027 financial results on August 26, 2026.

Analog Devices confirmed it will release fiscal Q3 2026 results on August 19, 2026, at 7:00 a.m. ET and hold an earnings call at 10:00 a.m. ET.

Microchip will hold its 2026 virtual annual meeting of stockholders on August 18, 2026, at 9:00 a.m. PDT.

Chief Operating Officer Richard J. Simoncic will resign from Microchip effective August 17, 2026, to become chief executive officer of private company Menlo Microsystems.

Applied Materials formally confirmed that it will report fiscal Q3 2026 results and hold its earnings call on August 13, 2026.

Coherent confirmed that it will report fiscal fourth-quarter and full-year 2026 results after the NYSE close on August 12, 2026, followed by a 4:30 p.m. ET webcast.

Microchip is estimated to release first-quarter fiscal 2027 results on August 6, 2026.

AMD is scheduled to report fiscal second-quarter 2026 financial results after market close on August 4, 2026.

Monolithic Power Systems is scheduled to report second-quarter 2026 financial results after market close on July 30, 2026.

Lam Research is scheduled to host its June 2026 quarter financial conference call on July 29, 2026.

Qualcomm is scheduled to release third-quarter fiscal 2026 results after market close on July 29, 2026.

Corning is scheduled to report second-quarter 2026 financial results and hold its earnings call on July 28, 2026, before the U.S. market opens.

KLA is scheduled to release fiscal 2026 fourth-quarter results after the market closes on July 28, 2026, with consensus EPS estimated at $1.00.

Teradyne plans to release its second-quarter 2026 financial results after market close on July 28, 2026.

Celestica remains scheduled to release Q2 2026 financial results after market close on July 27, followed by an 8:00 a.m. ET webcast call on July 28 led by CEO Rob Mionis and CFO Mandeep Chawla.

Samsung Electronics and Broadcom announced an MOU to expand collaboration on memory, leading-edge foundry and advanced packaging for next-generation AI infrastructure, estimated at more than $200 billion through 2030.

Intel and Lens Technology signed a one-year nonbinding memorandum to explore glass-through-via advanced packaging for future AI and data-center computing platforms.

Microchip signed a definitive agreement to acquire edge-AI processor and vision-processing provider Hailo, with closing expected toward the end of the quarter ending September 30, 2026.

NAVER, NVIDIA and Brookfield announced a proposed expansion of NAVER’s GAK Sejong NVIDIA DSX AI factory from 55 megawatts to 200 megawatts by 2028.

NVIDIA and SK Group announced a $500 billion-plus initiative spanning AI factories and a long-term partnership to secure and co-develop next-generation AI memory.

Reuters and other reporting said Qualcomm notified customers of planned double-digit price increases for products shipped after September 1, 2026.

AMD and Cerebras announced a technical partnership to deploy Helios systems with Cerebras Wafer-Scale Engine technology for a joint low-latency inference offering.

AMD launched the Helios rack-scale AI platform, Instinct MI400 GPUs including MI455X, and sixth-generation EPYC Venice CPUs at Advancing AI 2026.

Intel reported Q2 2026 revenue of $16.1 billion and non-GAAP EPS of $0.42, while guiding Q3 revenue to $15.8 billion-$16.8 billion and non-GAAP EPS to $0.38.

Intel committed to a high-volume ramp of its 14A process technology in 2028 while maintaining planned internal risk production in the second half of 2027.

NVIDIA and Amkor Technology signed a $1.5 billion multi-year agreement under which NVIDIA will prepay to expand Amkor’s U.S. advanced semiconductor packaging and test capacity.

AMD and Anthropic added an up-to-$5 billion AMD equity-investment commitment and a multiyear engineering collaboration to their planned deployment of up to 2 gigawatts of MI450 Series GPUs.

Qualcomm announced that Snapdragon platforms will power Samsung's new Galaxy foldable smartphones, first Snapdragon-powered Galaxy Watches, and intelligent eyewear.

Texas Instruments reported Q2 2026 revenue of $5.46 billion and diluted EPS of $2.14, and guided Q3 revenue to $5.65 billion-$6.15 billion and EPS to $2.23-$2.57.

Intel and Fortinet announced a collaboration to develop Fortinet Security Processor 6, which Intel will manufacture on its Intel 4 process node.

Intel confirmed that it is planning an additional, unspecified workforce reduction in its Data Center and AI Group as part of its efficiency program.

Bank of America added Micron to its U.S. 1 List while maintaining its Buy rating and $1,550 price target.

NVIDIA said Vera Rubin systems are entering production deployments and introduced the 102.4-terabit-per-second Spectrum-6 Ethernet switch system for gigascale AI factories.

Wistron opened its first U.S. smart factory in Fort Worth, Texas, for assembly and testing of NVIDIA AI systems, including GB300 production and planned Vera Rubin production.

AMD and Microsoft expanded their strategic partnership, with Microsoft set to deploy AMD Helios at scale on Azure for frontier-model inference and Azure AI services.

Lam Research became a founding member of CuspAI’s AI Materials Foundry, a global materials-discovery network focused in part on semiconductors.

NVIDIA expanded its Agent Toolkit with open Omniverse libraries for RTX sensor simulation, GPU-accelerated physics and simulation-ready asset validation.

Bristol Myers Squibb announced it will deploy an NVIDIA DGX SuperPOD built with DGX Vera Rubin NVL72 systems to expand AI-enabled drug discovery and development.