Index overviewEvent timeline

KRX K-AI Semiconductor TOP2 Plus Index

Korea's AI semiconductor value chain, anchored by Samsung Electronics and SK Hynix.

Recent events

23 of 23
Aug 26, 2026

NVIDIA is scheduled to report fiscal 2027 second-quarter results on August 26, providing a near-term read-through on AI infrastructure demand for SK hynix's next-generation memory partnership.

Aug 14, 2026

Korea Circuit had not filed its 2026 H1 report by August 10; August 14 remained one published estimated filing date, while another market-data provider indicated August 18.

Aug 14, 2026

HAESUNG DS's first-half 2026 report is due on August 14, providing the statutory detailed follow-up to its July 29 preliminary Q2 results.

Aug 14, 2026
Taesung Co Ltd (323280)
financial_results

Taesung’s 2026 first-half report is due by 14 August 2026, providing the next statutory update on operating performance.

Aug 14, 2026
TLB Co Ltd (356860)
financial_results

TLB remains due to submit its H1 2026 report by 14 August 2026 after already disclosing preliminary June-quarter results on 3 August.

Aug 13, 2026
GigaVis Co Ltd (420770)
financial_results

GigaVis’s Q2 2026 results remain an expected 13–14 August catalyst, with independent market calendars now indicating 13 August and 14 August respectively rather than an issuer-confirmed date.

Aug 10, 2026
SK Hynix Inc (000660)
strategic_transactions

SK hynix said no decision has been made on a reported sale of an ownership stake in its Chongqing packaging plant, while confirming a review of options to strengthen packaging-business competitiveness.

Aug 7, 2026

SK hynix approved KRW 54.3 trillion of new construction investment for the Yongin Y2 DRAM/HBM fab and Cheongju M17 NAND fab.

Aug 7, 2026

Samsung began general availability of the Galaxy Z Fold8 Ultra, Galaxy Z Fold8 and Galaxy Z Flip8 on August 7, completing the retail launch following record South Korean preorders.

Aug 7, 2026

SK hynix approved KRW 54.3246 trillion of new-facility investment for the Yongin Y2 DRAM fab and Cheongju M17 NAND fab through 2031.

Aug 6, 2026
HAESUNG DS Co Ltd (195870)
leadership_governance

JPMorgan Asset Management (Asia Pacific) Limited disclosed a new 5.22% passive stake in HAESUNG DS, comprising 887,755 shares as of the August 3 reporting date.

Aug 6, 2026
TLB Co Ltd (356860)
strategic_transactions

TLB resolved to enter a KRW 3.0 billion treasury-share acquisition trust with NH Investment & Securities, running from 6 August 2026 to 5 February 2027, to support its share price and shareholder value.

Aug 5, 2026
SK Hynix Inc (000660)
strategic_transactions

SK hynix said it is reviewing measures to strengthen U.S. subsidiary Solidigm after a report of a KRW 5 trillion pre-IPO, with no decision made and a re-disclosure due September 4, 2026.

Aug 5, 2026

Samsung entered five-year patent cross-license, settlement, memory-supply and ITC-cooperation agreements with Netlist, including a US$239 million upfront license payment and revenue-based quarterly payments.

Aug 5, 2026
Simmtech Co Ltd (222800)
financial_results

Simmtech forecast H2 2026 consolidated revenue of about KRW 1.072 trillion and operating profit of about KRW 163.1 billion.

Aug 5, 2026
Simmtech Co Ltd (222800)
financial_results

Simmtech reported preliminary consolidated Q2 2026 revenue of KRW 514.565 billion and operating profit of KRW 62.890 billion on 5 August 2026.

Aug 5, 2026
Simmtech Co Ltd (222800)
financial_results

Simmtech's preliminary H1 2026 revenue of KRW 936.936 billion and operating profit of KRW 76.601 billion exceeded the previously tracked KRW 863.4 billion and KRW 50.1 billion guidance figures.

Aug 4, 2026

SK hynix and Sandisk disclosed the first OCP HBF standard, specifying up to 512GB capacity and approximately 0.4TB/s to 3.0TB/s bandwidth.

Aug 4, 2026

Samsung announced Prime Video as the first streaming service to offer HDR10+ ADVANCED globally on supported titles for Samsung's 2026 TV lineup beginning in August 2026.

Aug 4, 2026

SK hynix released the first Open Compute Project HBF specification with Sandisk and said it plans to begin mass production of 375-layer 4D-NAND-based high-performance eSSDs in early 2027.