KRX AI Semiconductor Index

Digital Frontier's KRW 96.25 billion HBM4 wafer-tester supply contract with SK hynix is scheduled to end on August 31, 2026.

Tokai Carbon Korea is scheduled by market-data providers to release its Q2 2026 results on 18 August 2026.

Market-data providers list Park Systems' 2Q 2026 earnings release for 2026-08-18.

KCTech is expected to report its June-quarter 2026 results on 18 August 2026, according to two independent earnings-calendar providers.

D.I. must file its H1 2026 semiannual report by the August 14 statutory deadline.

Dongjin Semichem’s statutory deadline to file its H1 2026 report, containing Q2 financial results, is 14 August 2026.

Isupetasys’s first-half 2026 report is due by 14 August 2026 under Korea’s 45-day periodic-reporting deadline, while third-party calendars still list 18 August for Q2 earnings and no company confirmation was found through 27 July.

PSK HOLDINGS is scheduled to file its first-half 2026 report, including second-quarter financial results, by the August 14 statutory deadline.

STI is due to file its 2026 half-year report, covering the six months ended 30 June, by 14 August 2026 under Korea's 45-day periodic-reporting requirement.

TSE is expected to file its H1 2026 report by the August 14 statutory deadline, creating the next material results catalyst.

YC Corporation is expected to file its H1 2026 semiannual report by the statutory 45-day deadline of August 14, 2026.

HPSP is scheduled to reach the KRX deadline for filing its H1 2026 report on 14 August 2026.

GigaVis’s next earnings release for the quarter ended 30 June 2026 is expected in mid-August, with market calendars indicating 13–14 August.

Leeno Industrial is expected to disclose Q2/first-half 2026 results on 13 August 2026, although the company had not formally announced a release notice as of 24 July.

Daeduck Electronics expects to release preliminary consolidated results for the quarter ended June 30, 2026, on July 31, 2026.

Samsung Electronics is scheduled to present Q2 2026 results on July 30, a customer-demand read-through for D.I.'s semiconductor inspection-equipment contracts.

Samsung Electronics is scheduled to release its 2Q 2026 financial results and hold a conference call at 10:00 a.m. KST on July 30, 2026.

Samsung Electro-Mechanics is scheduled to release its Q2 FY2026 results on 2026-07-30.

SK hynix is scheduled to report FY2026 second-quarter earnings and hold its investor conference call on July 29, 2026 at 9:00 a.m. Seoul time.

SK hynix is scheduled to release Q2 2026 results and hold a Q&A session on July 29, providing a demand and investment read-through for D.I.'s HBM4 tester supply program.

Doosan Corporation is scheduled to present its second-quarter 2026 management performance on 2026-07-27.

ISC is scheduled to present its second-quarter 2026 management results on 2026-07-27.

Samsung Electronics and Broadcom announced an MOU for more than US$200 billion of memory, foundry, and advanced-packaging collaboration through 2030, including HBM for Broadcom AI accelerators.

Samsung Electronics and Broadcom signed an MOU for memory, sub-2nm foundry and advanced-packaging collaboration estimated at more than $200 billion through 2030.

SK hynix announced long-term next-generation AI-memory collaborations with NVIDIA and Microsoft as part of SK Group’s US$500-billion-plus AI-infrastructure initiative.

SK Group and NVIDIA announced a US$500 billion-plus AI-infrastructure initiative that includes a long-term SK hynix partnership to supply and co-develop next-generation AI memory, including HBM.

HPSP shares closed at KRW 35,650 on 24 July 2026, down KRW 4,000 or 10.09% from the prior close.

GigaVis disclosed a KRW 22.276 billion contract to supply semiconductor-substrate inspection and repair equipment to a Taiwanese substrate manufacturer, equal to 42.48% of 2025 revenue.

Leeno Industrial's union began an indefinite full strike on 23 July 2026 after rotating work stoppages, creating production and customer-delivery risk.

GIC Private Limited disclosed a new 5.093% passive ownership stake in ISC after on-market purchases.

SK hynix stated that it has neither pursued nor decided on acquiring Intel's Ohio land and fabrication facility, denying a media report of talks for U.S. memory production.

SK hynix clarified that the KRW 7.0931 trillion P&T7 decision increased the investment to accelerate cleanroom opening for additional AI-memory production needs.

Samsung confirmed pre-orders for the Galaxy Z Fold8 Ultra, Z Fold8 and Z Flip8 began on July 22, with general availability on August 7 and U.S. starting prices of $2,099.99, $1,899.99 and $1,199.99, respectively.

Korea Investment Securities issued a Q2 2026 preview forecasting Tokai Carbon Korea revenue of KRW 94.7 billion and operating profit of KRW 27.1 billion.

TSE completed payment and issued KRW 100 billion of its first privately placed convertible bonds on July 22, completing the financing announced on July 10.

Daol Investment & Securities raised GigaVis’s target price to KRW 230,000 while forecasting Q2 2026 earnings above both its prior estimate and consensus.

Samsung Electronics established the CEO-led RX Business Promotion Office to consolidate and commercialize its robotics capabilities.

Hanmi Semiconductor disclosed its 2026 Corporate Value Enhancement Plan, including a year-end second-generation hybrid bonder prototype target and a U.S. subsidiary initiative.

Daeduck Electronics decided on KRW 497 billion of new investment in semiconductor-product production equipment and ancillary facilities.

Daeduck Electronics agreed to acquire Newflex's land and factory buildings in Ansan for KRW 52.8 billion.